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| C33xx 5x7mm SMD HCMOS Clock Oscillator 3.3 Volts Model C33xx is a 1.544MHz to 156.250MHz HCMOS Clock Oscillator operating at 3.3Volts. The oscillator utilizes Fundamental or High Q Third Overtone crystal design providing very low Jitter and Phase Noise. No Sub-Harmonics are present in the Output Signal. 5x7mm SMD Applications: Digital Video SONET/SDH/DWDM Storage Area Networks Broadband Access Ethernet, Gigabit Ethernet Rev.: G Date: 03-06-08 C33xx 5x7mm SMD HCMOS Clock Oscillator 3.3 Volts Frequency Range: Frequency Stability Options(ppm): Temperature Range: (standard) (Option M) (Option E) Storage: Input Voltage: Input Current: (1.544~34.00MHz) (35.00~50.00MHz) (51.00~69.00MHz) (70.00~156.25MHz) Standby Current: Output: Symmetry: Rise/Fall Time: (1.54~10.00MHz) (10.10~30.00MHz) (30.10~50.00MHz) (50.10~80.00MHz) (80.10~156.25MHz) Logic: Disable Time Start-up Time 12KHz~80MHz 1.544 to 156.250Mhz 20, 25, 50, 100 0C to +70C -20C to +70C -40C to +85C -55C to 120C 3.3V 0.3V 18mA Max 25mA Max 30mA Max 45mA Max 3uA Typ., 10uA Max HCMOS 45/55% Max @ 50%Vdd 5nsec Max @ 20% to 80% Vdd 4nsec Max @ 20% to 80% Vdd 3nsec Max @ 20% to 80% Vdd 2.5nsec Max @ 20% to 80% Vdd 2nsec Max @ 20% to 80% Vdd "0"= 10% Vdd Max "1"= 90% Vdd Min. 200nSec Max 1mSec Typ., 2mSec Max 30pF Max, >125MHz 15pF Max 0.5psec Typ., 1psec Max None Load: Jitter RMS: Sub-harmonics: Aging: <3ppm 1st/yr, <1ppm every year thereafter Part Number C3390 C3392 C3391 C3398 Stability 100ppm 50ppm 25ppm 20ppm Example: C3392-44.736MHz Intermediate Temp: CM3392-44.736MHz Extended Temp: CE3392-44.736MHz C = 0C to 70C CM = -20C to 70C CE = -40C to 85C PART NUMBER GUIDE Rev.: G Date: 03-06-08 C33xx 5x7mm SMD HCMOS Clock Oscillator 3.3 Volts mA M pin 4 Vdd OUT OUT pin 3 O/P Load incl Probe Cl PWR Supply VM Bypass Cap. pin 1 OSC. GND pin 2 High Impedance GND or "LOW" Oscillation OPEN or "HIGH" Thermal Shock: MIL-STD-883, Method 1011, Condition A Moisture Resistance: MIL-STD-883, Method 1004 Environmental: TEMPERATURE Shock: Solderability: Vibration: Solvent Resistance: Resistance to Soldering Heat: Mechanical: MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2003 MIL-STD-883, Method 2007, Condition A MIL-STD-202, Method 215 MIL-STD-202, Method 210, Condition I or J RECOMMENDED REFLOW SOLDERING PROFILE 260C 217C 200C 150C Ramp-Up 3C/Sec Max. Critical Temperature Zone Ramp-Down 6C/Sec. Preheat 180 Secs. Max. 8 Minutes Max. 90 Secs. Max. 260C for 10 Secs. Max. NOTE: Reflow Profile with 240C peak also acceptable. 0.283 (7.20) P/N XXX Frequency XX 0.204 (5.02) 0.075 (1.80) Tri-State Function Open or N/C Pin #1 State Output State Active Active High Z Denotes pad 1 XXX=Date Code XX=Lot Code 0.055 Typ. (1.40 Typ.) #1 #4 #2 #3 0.045 0.008 (1.14 0.20) "1" level 0.7*Vcc Min SUGGESTED PAD LAYOUT 0.071 SQ (1.80) 0.165 (4.19) 0.200 (5.08) 0.01uF Bypass Capacitor Recommended "0" level 0.3*Vcc Max Pad 1 2 3 4 Enable/Disable GND Out Vcc Connection 0.200 0.005 (5.08 0.13) Rev.: G Date: 03-06-08 |
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